Euro-me Joins Hands with NEXENSOR to Participate in the CSEAC 2024
Source : Euro-me Shenzhen Trade & Development Co., Ltd. Time : 2024-09-25 Hits : 184
As the general agent for NEXENSOR and MSG in China, Eurome will participate in the CSEAC China with the two companies at the Wuxi International Expo Center from September 25th to 27th, 2024.
CSEAC， It is the abbreviation of China Semiconductor Equipment Annual Conference and Semiconductor Equipment and Core Component Exhibition. Since its establishment, it has taken it as its responsibility to promote the development of China´s semiconductor industry and is committed to building a professional, efficient, and cutting-edge platform for communication, exhibition, and cooperation for the industry.
As an authoritative event in the semiconductor industry, CSEAC brand represents high standards, specialization, and internationalization. Every annual conference brings together top domestic and international research institutions and industry experts in semiconductor manufacturing, packaging and testing, equipment and core components, material suppliers, etc., to jointly explore the latest technologies, market trends, and development opportunities in the semiconductor industry.
Our booth number is C1-77.
The CEO of Nexensor will give a keynote speech at this exhibition (Topic 1: 2024 Forum on New Developments in Semiconductor Equipment and Core Component Matching), introducing the latest 3D optical inspection technology and solutions for advanced packaging. The time will be from 16:10 to 16:30 on September 25th.
At this exhibition, we will showcase the latest testing technology applied by South Korean company Neeson in the semiconductor and display screen industries:
1. Provide a comprehensive 3D optical measurement solution for the advanced semiconductor packaging industry.
2. White light interferometric scanning sensor - with a measurement speed of only 1 second and a Z-axis repeatability accuracy of 10nm, it can be integrated into the device for batch detection.
3. Interferometric thickness/displacement sensor - using near-infrared interferometry, a single probe can measure thickness/displacement, suitable for applications such as wafer thickness measurement.
We look forward to many new and old customers and friends visiting our booth to guide and discuss cooperation!
Exhibited products:
3D optical metrology solution 3D scanning WLI
Thickness and displacement sensor
In addition, our company will also showcase the German MSG autofocus sensor. The German MSG autofocus sensor is applied in defect detection of panels, glass and other products, suitable for TFT-LCD, OLED, Micro/MiniLED and other products.
Welcome to our booth to have a look at our solution and talk about cooperation issue!
If you are interested in nexensor and MSG related products and solutions, please contact:
Martin@euro-me.com Tel: 0755-83842035 MP：13632890602